This part of IEC 60749 provides a steady-state temperature and humidity bias life test for the purpose of evaluating the reliability of non-hermetic packaged solid-state devices in humid environments. NOTE This test is in general accord with IEC 60068-2-3 (withdrawn)1, but due to specific requirements of semiconductors, the following text is applied. This test method is considered destructive.
GSO IEC 60749-5:2014 history
2014GSO IEC 60749-5:2014 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test