HG/T 3593-1999
Cupric pyrophosphate for electroplating use (English Version)
- Standard No.
- HG/T 3593-1999
- Language
- Chinese, Available in English version
- Release Date
- 1999
- Published By
- Professional Standard - Chemical Industry
- Status
- 2010-06
- Replace By
- HG/T 3593-2009
- Latest
- HG/T 3593-2009
- Scope
- This standard specifies the requirements, test methods, inspection rules, markings, labels, packaging, transportation and storage of copper pyrophosphate for electroplating. This standard applies to copper pyrophosphate for electroplating. Mainly used for cyanide-free electroplating. Molecular formula: Cu|(2)P|(2)O|(7)·3H|(2)O Relative molecular mass: 355.08 (according to the 1995 international relative atomic mass)
HG/T 3593-1999 history
- 2009 HG/T 3593-2009 Cupric pyrophosphate for electroplating use
- 1999 HG/T 3593-1999 Cupric pyrophosphate for electroplating use
