BS EN IEC 61189-5-503:2017
Test methods for electrical materials, printed board and other interconnection structures and assemblies - General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards
- Standard No.
- BS EN IEC 61189-5-503:2017
- Release Date
- 2018
- Published By
- British Standards Institution (BSI)
- Latest
- BS EN IEC 61189-5-503:2017
- Scope
- What is BS EN IEC 61189-5-503- CAF testing of circuit board about? BS EN IEC 61189 covers test methods for electrical materials, printed boards, and other interconnection structures and assemblies. The main objective of the IEC 61189 series is to demonstrate the reliability of laminate materials and assemblies and avoid printed circuit board failures. BS EN IEC 61189-5-503 is an international standard for electric materials that specifies the test methods for materials and assemblies which is helpful in measuring the ionic residues which are dissolved in ionic contamination solutions. BS EN IEC 61189-5-503 ...
BS EN IEC 61189-5-503:2017 history
- 2018 BS EN IEC 61189-5-503:2017 Test methods for electrical materials, printed board and other interconnection structures and assemblies - General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards
