PD IEC TR 61760-3-1:2022
Surface mounting technology - Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method
- Standard No.
- PD IEC TR 61760-3-1:2022
- Release Date
- 2022
- Published By
- British Standards Institution (BSI)
- Latest
- PD IEC TR 61760-3-1:2022
PD IEC TR 61760-3-1:2022 history
- 2022 PD IEC TR 61760-3-1:2022 Surface mounting technology - Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method
