CNS 10560-1985
Thin Copper-Clad Laminates for Multilayer Printed Circuits (Glass Fabric Base, Epoxy Resin) (English Version)
- Standard No.
- CNS 10560-1985
- Language
- Chinese, Available in English version
- Release Date
- 1985
- Published By
- Taiwan Provincial Standard of the People's Republic of China
- Latest
- CNS 10560-1985
- Scope
- This standard applies to multi-layer printed circuit boards and multi-layer printed circuit copper laminates (hereinafter referred to as copper laminates). One or both sides of the laminate have a nominal thickness of 0.018 mm, 0.035 mm or 0.070 mm. Made of laminated copper foil, the thickness of the insulation board is 0.1mm or more but less than 0.8mm. However, it does not apply to the part within 6 mm from the end of the copper laminate.
CNS 10560-1985 history
- 1985 CNS 10560-1985 Thin Copper-Clad Laminates for Multilayer Printed Circuits (Glass Fabric Base, Epoxy Resin)
