CNS 10555-1985
Method of Test for Copper-Clad Laminates for Printed Circuits (English Version)
- Standard No.
- CNS 10555-1985
- Language
- Chinese, Available in English version
- Release Date
- 1985
- Published By
- Taiwan Provincial Standard of the People's Republic of China
- Latest
- CNS 10555-1985
- Scope
- This standard applies to the test methods for copper laminated boards for printed circuits (hereinafter referred to as copper laminated boards). The copper laminated board for printed circuits referred to here refers to the phenolic resin laminated board or epoxy resin laminated board with a nominal thickness of 0.018mm, 0.035mm or 0.070mm on one or both sides of the printed circuit board. The copper foil is laminated to make a copper laminated board with a thickness of more than 0.5mm and less than 3.2mm.
CNS 10555-1985 history
- 1985 CNS 10555-1985 Method of Test for Copper-Clad Laminates for Printed Circuits
