T/ZZB 2675-2022
Monocrystalline silicon as lapped wafers for TVS (English Version)
- Standard No.
- T/ZZB 2675-2022
- Language
- Chinese, Available in English version
- Release Date
- 2022
- Published By
- Group Standards of the People's Republic of China
- Latest
- T/ZZB 2675-2022
- Scope
- This document specifies the terms and definitions, product classification, basic requirements, technical requirements, test methods, inspection rules, marking, packaging, transportation and Storage, order (or contract) content and quality commitments. This document applies to silicon single crystal grinding wafers with diameters of 100 mm, 125 mm, and 150 mm prepared by the Czochralski method using electronic grade polysilicon as the main raw material.
T/ZZB 2675-2022 history
- 2022 T/ZZB 2675-2022 Monocrystalline silicon as lapped wafers for TVS
