ASTM F534-02a PDF

Scope: Full Description This standard was transferred to SEMI (www.semi.org) May 20031.1 This test method covers determination of the average amount of bow of nominally circular silicon wafers, polished or unpolished, in the free (non-clamped) condition. 1.2 This test method is intended primarily for use with wafers that meet the dimension and tolerance requirements of SEMI Specifications M1. 1.3 This test method can also be applied to circular wafers of other semiconducting materials, such as gallium arsenide, or electronic substrate materials, such as sapphire or gadolinium gallium garnet, that have a diameter of 25 mm or greater, a thickness of 0.18 mm or greater, and a ratio of diameter to thickness up to 250. Wafers to be tested may have one or more fiducial flats provided they are located in such a way that the slice can be centered on the support pedestals (see 7.1.2) without falling off. 1.4 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only. 1.5 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

ASTM F534-02a Referenced Document

ASTM F1390 Standard Test Method for Measuring Warp on Silicon Wafers by Automated Noncontact Scanning*， 1997-04-20 Update
ASTM F533 Standard Test Method for Thickness and Thickness Variation of Silicon Wafers*， 1996-04-20 Update
ASTM F657
ISO 14644-1 Cleanrooms and associated controlled environments - Part 1: Classification of air cleanliness by particle concentration (includes Redline Version)*， 2015-02-01 Update