The T/CEMIA 038-2023 standard, published on November 14, 2023, and effective from December 30, 2023, pertains to the low-temperature curing encapsulating paste used for chip resistors in China. This specification aims to set out detailed requirements for the material composition, physical properties, chemical stability, and operational parameters of this type of encapsulating paste. It is designed to facilitate the manufacturing process by ensuring that the encapsulant can effectively protect the chip resistor while maintaining low-temperature curing capabilities, thereby reducing thermal stress on the components during production.
The standard encompasses various tests for evaluating performance such as adhesion strength, heat resistance, moisture barrier properties, and electrical insulation characteristics. These assessments are crucial to guaranteeing the reliability and longevity of products using this encapsulating paste in chip resistor applications.
*** Please note: This description may not be accurate, please refer to the official documentation.
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Update:
Wed, 01 Apr 2026 23:39:21 +0000