T/CASME 1243-2024
Construction Requirement for intelligent agriculture comprehensive platforms (English Version)

Standard No.
T/CASME 1243-2024
Language
Chinese, Available in English version
Release Date
2024
Published By
Group Standards of the People's Republic of China  CN  /  TUANTI
Latest
T/CASME 1243-2024
 

Scope
This document stipulates the general requirements, construction principles, platform architecture, service function requirements, construction requirements, operation and maintenance and guarantee for the construction of a smart agricultural comprehensive service platform.

T/CASME 1243-2024 history

  • 2024 T/CASME 1243-2024 Construction Requirement for intelligent agriculture comprehensive platforms

Topics on standards and specifications

Standard and Specification

ES 2866-3:2005 PRINTED BOARDS – TEST METHODS -PART : 3 MISCELLANEOUS TESTS GSO IEC 60603-6:2013 Connectors for frequencies below 3 MHz for use with printed boards. Part 6: Edge socket connectors and printed board connectors with 2.54 mm (0.1 in) contact spacing for single or double sided printed boards of 1.6 mm (0.063 in) nominal thickness BS EN 60603-6:1998 Connectors for frequencies below 3 MHz for use with printed boards. Edge-socket connectors and printed board connectors with 2,54 mm (0,1 in) contact spacing for single or double-sided printed boards of 1,6 mm (0,063 in) nominal thickness BS EN 61189-5-3:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - General test methods for materials and assemblies. Soldering paste for printed board assemblies LST EN 61189-1:2001 Test methods for electrical materials, interconnection structures and assemblies. Part 1: General test methods and methodology (IEC 61189-1:1997) IPC D-351-1985 Printed Board Drawings in Digital Form GB 19651.3-2008 Miscellaneous lampholders.Part 2-2:Particular requirements.Connectors for LED-modules DIN EN 61189-3-719 E:2014-04 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change duri... EVS-EN IEC 61189-5-601:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test ... KS C 6066-1997 Single and double sided printed wiring boards



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