QJ 3258-2005
Technical requirements for silicone rubber bonding and potting of aerospace electronic and electrical products (English Version)

Standard No.

QJ 3258-2005

Language

Chinese, Available in English version

Release Date

2005

Published By

Professional Standard - Aerospace  CN  /  QJ

Latest

QJ 3258-2005

Replace

QJ/Z 159.1-1985 QJ/Z 159.2-1985 QJ/Z 159.3-1985

Scope

This standard stipulates the technical requirements and inspection requirements for the bonding and potting of aerospace electronic and electrical products using silicone rubber. This standard is applicable to the bonding and potting of room temperature vulcanized silicone rubber materials using single-component silicone rubber materials. Cementing and potting using other silicone rubber materials can also be performed by reference.

QJ 3258-2005 Referenced Document

• GB/T 1723-1993 Determination of viscosity of coatings
• QJ 165A-1995 General technical requirements for installation of aerospace electronic and electrical products
• QJ 2711 Technical requirements for installation process of electrostatic discharge sensitive devices
• QJ 2829-1996 General technical requirements for potting and bonding of aerospace electronic and electrical products
• QJ 2850 Aerospace Product Surplus Prevention and Control
• QJ 3012-1998 Technical requirements for through-hole mounting of components of aerospace electronic and electrical products
• QJ 3259 Technical requirements for protective coating of aerospace electronic products

QJ 3258-2005 history

• 2005 QJ 3258-2005 Technical requirements for silicone rubber bonding and potting of aerospace electronic and electrical products
• 1985 QJ/Z 159.3-1985 Partial packaging process details

QJ 3258-2005 Technical requirements for silicone rubber bonding and potting of aerospace electronic and electrical products has been changed from QJ/Z 159.1-1985 Complete machine and parts seal pouring process rules.

QJ 3258-2005 Technical requirements for silicone rubber bonding and potting of aerospace electronic and electrical products has been changed from QJ/Z 159.2-1985 Detailed Rules for Potting and Sealing Process of Printed Circuit Board Assemblies.

QJ 3258-2005 Technical requirements for silicone rubber bonding and potting of aerospace electronic and electrical products has been changed from QJ/Z 159.3-1985 Partial packaging process details.

Topics on standards and specifications

Standard and Specification