PD IEC TS 62878-2-10:2024
Device embedding assembly technology Part 2-10: Design specification for cavity substrate
- Standard No.
- PD IEC TS 62878-2-10:2024
- Release Date
- 2024
- Published By
- British Standards Institution (BSI) GB / BSI
- Latest
- PD IEC TS 62878-2-10:2024
- Scope
- This document provides a general specification for the design of cavity substrates.
PD IEC TS 62878-2-10:2024 Referenced Document
- IEC 60194-2 Electronic assembly, design and circuit boards – Vocabulary – Part 2: Common usage in electronic technologies as well as electronic assembly technologies*， 2025-02-01 Update
PD IEC TS 62878-2-10:2024 history
- 2024 PD IEC TS 62878-2-10:2024 Device embedding assembly technology Part 2-10: Design specification for cavity substrate
Standard and Specification
IEC TS 62878-2-10:2024 Device embedding assembly technology - Part 2-10: Design specification for cavity substrate
BS PD IEC TS 62878-2-10:2024 Device embedding assembly technology-Part 2-10: Design specification for cavity substrate
IEC 62878-2-5:2019 Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
BS EN IEC 62878-2-5:2019 Device embedding assembly technology - Guidelines. Implementation of a 3D data format for device embedded substrate
BS EN 62878-1-1:2015 Device embedded substrate - Generic specification. Test methods
PD IEC/TS 62878-2-3:2015 Device embedded substrate. Guidelines. Design guide
BS EN IEC 62878-1:2019 Device embedding assembly technology - Generic specification for device embedded substrates
TS 62878-2-3-2015 Substrat avec appareil(s) intégré(s) – Partie 2-3: Directives – Guide de conception (Edition 1.0
DIN EN IEC 62878-2-602 E:2020-11 Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity