KS T 1337-2023
Standard practice for conditioning containers, packages or packaging components for testing

Standard No.
KS T 1337-2023
Release Date
2023
Published By
Korean Agency for Technology and Standards (KATS)  KR  /  KATS
Latest
KS T 1337-2023
 
Introduction
This standard specifies the procedures for the implementation of test regulations for adjustment containers, packaging, or packaging components. It provides guidelines and requirements to ensure consistency and reliability in testing processes related to these items.

KS T 1337-2023 history

  • 2023 KS T 1337-2023 Standard practice for conditioning containers, packages or packaging components for testing
  • 0000 KS T 1337-2013(2018)
  • 2013 KS T 1337-2013 Standard practice for conditioning containers, packages or packaging components for testing
  • 2003 KS T 1337-2003 Standard practice for conditioning containers, packages or packaging components for testing

Standard and Specification

ASTM D4332-00 Standard Practice for Conditioning Containers, Packages, or Packaging Components for Testing ASTM D4332-99 Standard Practice for Conditioning Containers, Packages, or Packaging Components for Testing ASTM D4332-22 Standard Practice for Conditioning Containers, Packages, or Packaging Components for Testing ASTM D4332-01(2006 Standard Practice for Conditioning Containers, Packages, or Packaging Components for Testing ASTM D4332-13 Standard Practice for Conditioning Containers, Packages, or Packaging Components for Testing ASTM D4332-14 Standard Practice for Conditioning Containers, Packages, or Packaging Components for Testing ASTM D4332-01e1 Standard Practice for Conditioning Containers, Packages, or Packaging Components for Testing ASTM D4332-01e2 Standard Practice for Conditioning Containers, Packages, or Packaging Components for Testing ASTM D4332-01 Standard Practice for Conditioning Containers, Packages, or Packaging Components for Testing GOST IEC TR 61340-5-5-2022 Electrostatics. Protection of electronic devices from electrostatic phenomena. Requirements to packaging used in electronic manufacturing


Copyright ©2026 All Rights Reserved
Update: Wed, 03 Jun 2026 22:55:21 +0000