KS C IEC 60249-2-19-2013
Base materials for printed circuits-Part 2 : Specifications Specification No.19 : Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

Standard No.

KS C IEC 60249-2-19-2013

Release Date

2013

Published By

Korean Agency for Technology and Standards (KATS)  KR  /  KATS

Latest

KS C IEC 60249-2-19-2013

Introduction

This standard specifies the requirements for thin bismaleimide/triazine modified epoxy copper clad laminates with specified flammability characteristics intended for use in the manufacture of multilayer printed circuit boards. It is part of a series of standards covering base materials for printed circuits and provides detailed technical specifications to ensure consistent quality and performance of these critical components used in electronic devices.

*** Please note: This description may not be accurate, please refer to the official documentation.

KS C IEC 60249-2-19-2013 history

• 2013 KS C IEC 60249-2-19:2013 Base materials for printed circuits-Part 2 : Specifications Specification No.19 : Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
• 0000 KS C IEC 60249-2-19-2002(2012)
• 2002 KS C IEC 60249-2-19:2002 Base materials for printed circuits-Part 2 : Specifications Specification No.19 : Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

Standard and Specification