GB/Z 41275.23-2023
Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free Solder Part 23: Rework/Repair Guidelines for Lead-Free and Mixed Electronics (English Version)

Standard No.: GB/Z 41275.23-2023
Language: Chinese, Available in English version
Release Date: 2023
Published By: General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China CN / GB
Latest: GB/Z 41275.23-2023

Introduction: This document provides guidelines for the rework and repair of lead-free and mixed-content electronic products within aerospace and defense systems. It is part of a series focusing on process management in avionics, specifically addressing the use of lead-free solder in electronic systems. The standard aims to ensure the reliability and quality of repairs by offering detailed instructions on how to handle these specific types of components during maintenance operations.
*** Please note: This description may not be accurate, please refer to the official documentation.

GB/Z 41275.23-2023 history

2023 GB/Z 41275.23-2023 Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free Solder Part 23: Rework/Repair Guidelines for Lead-Free and Mixed Electronics

Standard and Specification

DIN IEC TS 62647-3 DIN SPEC 42647-3 E:2013-12 Avionics process management - Aerospace and defence electronic products containing lead-free solders - Part 3: Performance testing of lead-free solder GSO IEC/TS 62647-23:2015 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address PD IEC/TS 62647-1:2012 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder. Preparation for a lead-free control plan TS 62647-23-2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address PD IEC/TS 62647-2:2012 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder. Mitigation of deleterious effects of tin PD IEC/TS 62647-23:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder. Rework and repair guidance to address the implications SAE GEIAHB0005_3-2015 Rework/Repair Handbook to Address the Implications of Lead-Free Electronics and Mixed Assemblies in Aerospace and High Performance Electronic Systems GEIA-HB-0005-3-2008 Rework/Repair Handbook to Address the Implications of Lead-Free Electronics and Mixed Assemblies in Aerospace and High Performance Electronic Systems PD IEC/TS 62647-4:2018 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder. Ball grid array (BGA) re-balling

GB/Z 41275.23-2023Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free Solder Part 23: Rework/Repair Guidelines for Lead-Free and Mixed Electronics (English Version)

GB/Z 41275.23-2023 history

Standard and Specification

GB/Z 41275.23-2023
Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free Solder Part 23: Rework/Repair Guidelines for Lead-Free and Mixed Electronics (English Version)