| Project Dimensions | Specific Requirements | Scope of Application |
|---|---|---|
| Coating Structure | The bottom coating is made of copper or nickel, and the surface coating is made of lead-tin, gold or chemical nickel. | Applicable to materials such as aluminum-based silicon carbide and copper diamond. |
| Thickness Requirements | The total thickness ranges from 7 to 25 microns, and the surface coating thicknesses are 1.5 to 3 microns (gold), 7 to 10 microns (lead-tin) and not less than the requirements. | Determine the specific value according to product requirements. |
| High temperature resistance | Gold plating: 350°C; lead-tin alloy: 150°C; nickel plating: 350°C. | Ensure stability and reliability at extreme temperatures. |
For example, in the packaging of a spacecraft navigation system, a gold plating layer was selected as the surface plating layer (thickness of 1.5~3 microns) and matched with a copper bottom plating layer. The adhesion strength and solderability of the plating layer at 220°C were verified through high temperature resistance tests and normal pressure thermal cycle tests.

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Update:
Thu, 12 Mar 2026 19:35:14 +0000