BS IEC 62047-43:2024
Semiconductor devices. Micro-electromechanical devices - Test method of electrical characteristics after cyclic bending deformation for flexible micro-electromechanical devices
- Standard No.
- BS IEC 62047-43:2024
- Release Date
- 2024
- Published By
- British Standards Institution (BSI) GB / BSI
- Latest
- BS IEC 62047-43:2024
- Introduction
Analysis of the core content of the standard
This standard establishes a unified method for testing the electrical characteristics of flexible micro-electromechanical devices (MEMS) under cyclic bending loads, focusing on solving the reliability assessment problems of products such as flexible sensors and foldable electronic devices. The performance degradation law of the device is visualized through the three-dimensional PSN curve (performance-bending severity-number of cycles).
Key technical requirements
Test elements IEC 62047-35(static bending) IEC 62047-43(cyclic bending) Test purpose Single bending limit assessment Performance degradation law under cyclic load Core parameters Minimum folding distance dmin Folding distance range (dmin-dmax) Data presentation PS two-dimensional curve Three-dimensional PSN surface Test cycle Single loading ≥104 cycles
Key points for test implementation
Equipment configuration requirements
The test device must meet the following requirements: Loading wall parallelism error < specimen thickness, surface roughness <0.1 times thickness, displacement measurement accuracy is controlled according to the folding distance:
- d＞l/2: ±1%
- l/3＜d≤l/2: ±3%
- d≤l/10: ±5%
Specimen preparation specifications
Recommended rectangular specimen size: length 1-300mm, thickness 10μm-1mm. It is necessary to ensure that the functional area is located at the center line of the specimen, and the bending axis direction should include two orientation tests of 0° and 90°.
Construction of three-dimensional PSN curve
Through multiple groups of different dmin/dmax combination tests, the surface of performance parameters (resistance/capacitance, etc.) changing with bending severity and number of cycles is plotted:
- Initial performance: baseline value at maximum folding distance
- First bending: record performance decay at dmin
- Cycling stage: measure performance at dmin and dmax after every N cycles
Typical termination condition: performance decays to 10% of the initial value or 106 cycles are completed.
Recommendations for the application of standards
Product development stage
It is recommended to conduct multi-axis cyclic testing in the early stage of flexible circuit design to identify brittle interconnection parts. The example case shows that the resistance of a 0.2mm silver wire increases by 40% after 2000 cycles at a folding distance of 30mm.
Test report requirements
Must include: bending direction/position diagram, specimen size (key length parameter), three-dimensional performance degradation curve, test conditions (temperature and humidity/load frequency). It is recommended to add a two-dimensional cross-section diagram to enhance data readability.
Technology evolution background
With the surge in demand for flexible sensors in the Internet of Things, the traditional static bending test (IEC 62047-35) can no longer meet the actual working condition evaluation. The PSN method of this standard innovatively solves the following problems: multi-level load coupling effect evaluation, special testing requirements for foldable equipment and so on, providing the industry with a unified reliability verification framework.
BS IEC 62047-43:2024 Referenced Document
- IEC 62047-35:2019 Semiconductor devices – Micro-electromechanical devices - Part 35: Test method of electrical characteristics under bending deformation for flexible electro-mechanical devices
BS IEC 62047-43:2024 history
- 2024 BS IEC 62047-43:2024 Semiconductor devices. Micro-electromechanical devices - Test method of electrical characteristics after cyclic bending deformation for flexible micro-electromechanical devices
