BS EN IEC 60749-5:2024
Semiconductor devices. Mechanical and climatic test methods - Steady-state temperature humidity bias life test
- Standard No.
- BS EN IEC 60749-5:2024
- Release Date
- 2024
- Published By
- British Standards Institution (BSI) GB / BSI
- Latest
- BS EN IEC 60749-5:2024
- Introduction
Analysis of the core content of the standard
This standard replaces BS EN 60749-5:2017 and is equivalent to IEC 60749-5:2023 third edition. It mainly evaluates the reliability of non-hermetic packaged semiconductor devices in humid environments and is a destructive test method.
Key Technology Changes
Change Dimensions 2017 Edition 2024 Edition Equipment Requirements Humidity gradient control is not specified Requires to minimize humidity gradients between devices and maximize airflow Test Fixtures No anti-condensation requirements Explicitly prohibits condensation on the devices under test and electrical fixtures Terminology Standards Use the term "virtual junction" Use the term "die"
Test condition specifications
The standard stipulates that the basic test conditions are: temperature 85±2℃, relative humidity 85±5%RH, and duration of 1000 hours. Key parameter control requirements:
- Heating/cooling time ≤ 3 hours
- Wet bulb temperature 81.0℃ (reference value)
- Water vapor pressure 49.1kPa (reference value)
Bias configuration selection
Two bias schemes are provided according to the differences in device thermal characteristics:
- Continuous bias: Suitable for junction temperature rise ΔTja<10℃
- Cyclic bias: Recommended 1 hour on/1 hour off cycle, suitable for plastic packaged microcircuits with ΔTja≥10℃
When the power consumption of a single device is >200mW, the actual junction temperature must be measured or calculated and recorded.
Implementation points
Anti-pollution control
Special attention should be paid to:
- Use deionized water with a resistivity ≥1×10⁴Ωm
- Choose board and socket materials with low precipitation pollution
- Wear anti-pollution gloves throughout the test
Test interruption processing
After intermediate measurement, the device should:
- Return to the test within 96 hours under normal conditions
- Extended to 288 hours when sealed with moisture-proof bags
- The final electrical performance test must be completed within 48 hours after the cooling is completed
Relationship with HAST test
When this standard is combined with IEC When 60749-4 (HAST test) is performed simultaneously, the results of this test have priority. HAST is an accelerated test method, and the failure mechanism activated by it should be consistent with this test.
BS EN IEC 60749-5:2024 Referenced Document
- IEC 60749-4 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
BS EN IEC 60749-5:2024 history
- 2024 BS EN IEC 60749-5:2024 Semiconductor devices. Mechanical and climatic test methods - Steady-state temperature humidity bias life test
