This Design guide for semiconductor packages defines the general outline drawings, dimensions and tolerances for Fine-pitch Ball Grid Array (FBGA) packages and Fine-pitch Land Grid Array (FLGA) packages without regard to the package structures or materials. Being reduced-pitch version of Ball Grid Array (BGA) packages and Land Grid Array (LGA) packages, FBGA and FLGA are categorized as Form-D in "Recommended practice on standard for the preparation of outline drawings of semiconductor packages", JEIT A ED-7300, with the terminal pitch of 0.8 mm or less.