GEIA-HB-0005-3-2008 Rework/Repair Handbook to Address the Implications of Lead-Free Electronics and Mixed Assemblies in Aerospace and High Performance Electronic Systems
Government Electronic & Information Technology Association
Scope
This document provides technical background, procurement guidance, engineering procedures,
and guidelines to assist organizations reworking/repairing aerospace and high performance
electronic systems, whether they were assembled or previously reworked/repaired using traditional alloys such as SnPb or Pb-free alloys, or a combination of both solders and surface
finishes. This document contains a review of known impacts and issues, processes for rework/repair, focused to provide the technical structure to allow the repair technician to execute the task.
This document focuses on the removal and replacement of piece parts. For the purposes of this
document, the term “Rework/Repair” is used as applicable.
NOTE: The information contained within this document is based on the current knowledge of the industry at the time of publication. Due to the rapid changing
knowledge base, this document should be used for guidance only.
GEIA-HB-0005-3-2008 Referenced Document
GEIA-HB-0005-1 Program Management/Systems Engineering Guidelines For Managing The Transition To Lead-Free Electronics
GEIA-HB-0005-2 Technical Guidelines for Aerospace and High Performance Electronic Systems Containing Lead-free Solder and F inishes*， 2024-04-19 Update
GEIA-STD-0005-1 Performance Standard for Aerospace and High Performance Electronic Systems Containing Lead-free Solder
GEIA-STD-0005-2 Standard for Mitigating the Effects of Tin Whiskers in Aerospace and High Performance Electronic Systems
GEIA-STD-0005-3 Performance Testing for Aerospace and High Performance Electronic Interconnects Containing Pb-free Solder and Finishes