Electronic Components, Assemblies and Materials Association
Status
Scope
This publication applies to all integrated circuits and their associated packages. The document
summarizes the suite of reliability documents and publications available. These documents address
reliability qualification, reliability stress testing, and reliability modeling.
The purpose of this publication is to provide an overview of some of the most commonly used systems
and test methods historically performed by manufacturers to assess and qualify the reliability of solid state products. The appropriate references to existing and proposed JEDEC or joint standards and publications are cited. This document is also intended to provide an educational background and overview of some of the technical and economic factors associated with assessing and qualifying microcircuit reliability.