IPC A-610D JAPANESE-2005
Acceptability of Electronic Assemblies ??????????

Standard No.

IPC A-610D JAPANESE-2005

Release Date

2005

Published By

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

Replace

IPC A-610B-1994

IPC A-610D JAPANESE-2005 Referenced Document

• IPC 
• IPC 7095 Design and Assembly Process Implementation for BGAs
• IPC D-279 Design Guidelines for Printed Circuit Board Assemblies with Reliable External Mount Technology
• IPC SM-785 Guidelines for Accelerated Reliability Testing of External Mount Solder Attachments