The purpose of this part of IEC 60749 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance, or both.
BS EN 60749-3:2002 history
2018BS EN IEC 60749-12:2018 Semiconductor devices. Mechanical and climatic test methods. Vibration, variable frequency
2002BS EN 60749-12:2002 Semiconductor devices - Mechanical and climatic test methods - Vibration, variable frequency
1999BS EN 60749:1999 Semiconductor devices - Mechanical and climatic test methods