IPC TM-650 5.5.2.2-1998
Test Method 2.6.3.2 - Insulation and Moisture Resistance

Standard No.

IPC TM-650 5.5.2.2-1998

Release Date

1998

Published By

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

Status

Withdraw

Scope

To determine the resistance of the laminate to thermal stress in both the etched and unetched state.