IPC TM-650 5.5.1.3-1998
IPC-B-25 - Multipurpose Test Board - Side 1 and Side 2
- Standard No.
- IPC TM-650 5.5.1.3-1998
- Release Date
- 1998
- Published By
- Institute of Interconnecting and Packaging Electronic Circuits (IPC)
- Status
- Scope
- This specification covers qualification and performance of rigid printed boards. The printed board may be single-sided, double-sided, with or without plated-through holes. The printed board may be multilayer with plated-through holes and with or without buried/blind vias. The printed board may be multilayer containing build up HDI layers conforming to IPC-6016. The printed board may contain active embedded passive circuitry with distributive capacitive planes, capacitive or resistive components. The printed board may contain a metal core or external metal heat frame, which may be active or nonactive. Revision level changes are described in 1.6.
