IPC TM-650 5.1.100-1975
Analysis of Copper Fluoborate Electroplating Solutions

Standard No.
IPC TM-650 5.1.100-1975
Release Date
1975
Published By
Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Status
Scope
This Section of the Design Guide deals with the initial effort in the design of a printed board that must take into account many considerations that have to be resolved prior to the starting of the layout.



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