Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Status
Scope
This document establishes design concepts, guidelines, and
procedures intended to promote appropriate ‘Design for
Reliability (DfR)’ procedures and to ensure reliable printed
wiring assembly (PWA) characteristics. The major focus of
the information presented is directed toward those PWAs
that have surface mount (SM) components, either totally, or
intermixed with through-hole components, mounted on one
or both sides of the mounting structure.