IPC TM-650 2.6.9.1-1995
Test to Determine Sensitivity of Electronic Assemblies to Ultrasonic Energy

Standard No.
IPC TM-650 2.6.9.1-1995
Release Date
1995
Published By
Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Scope
The purpose of this Assembly and Joining Handbook is to provide practical and useful information regarding various approaches and techniques for the interconnection of electronic components. The table of contents is an indication of the variety of data included in this document.



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