IPC TM-650 2.6.5-2004
Physical Shock, Multilayer Printed Wiring Revision D

Standard No.
IPC TM-650 2.6.5-2004
Release Date
2004
Published By
Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Status
Scope
The purpose of this document is to define the Process Capability, Quality, and Relative Reliability (PCQR2) Benchmark Test Standard and Database Program used for the evaluation of Printed Circuit Board (PCB) manufacturing processes. This is in accordance with The National Technology Roadmap for Electronic Interconnections 2000/2001 published by IPC, which states that ‘‘For a company to efficiently manage its supply chain it must identify the capability of its suppliers and make certain that their capability for manufacturing a product is consistent with the needs of the customer.’’



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