Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Scope
This document
describes manufacturing process simulations for use with
applicable component specifications to assure that electronic
components can meet expected reliability requirements
after exposure to assembly factory processes. It is
not intended as an assembly production specification or a
stand-alone qualification document. The procedure consists
of a set of assembly process simulations that can be performed
by either the component user or manufacturer prior
to reliability testing as specified in the applicable component
qualification and reliability monitoring documents.
The simulations include alternative conditions depending
on the component type, physical characteristics and anticipated
use. The levels defined can be used for describing
either expected performance characteristics by the manufacturer
or the required characteristics for the users assembly
process.