Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Status
Scope
This document describes manufacturing process simulations
for use with applicable component specifications to assure
that electronic components can meet expected reliability
requirements after exposure to assembly factory processes. It
is not intended as an assembly production specification or a
stand alone qualification document. The procedure consists of
a set of assembly process simulations which can be performed
by either the component user or manufacturer prior to
reliability testing as specified in the applicable component
qualification and reliability monitoring documents. The simulations
include alternative conditions depending on the component
type, physical characteristics and anticipated use.