IPC TR-585-2006
Time, Temperature and Humidity Stress of Final Board Finish Solderability

Standard No.
IPC TR-585-2006
Release Date
2006
Published By
Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Scope
Any document involving a complex technology draws material from a vast number of sources. While the principal members of the Alternate Final Finishes Task Group (5-23d) of the Assembly & Joining Processes Committee (5-20) are shown below, it is not possible to include all of those who assisted in the evolution of this standard. To each of them, the members of the IPC extend their gratitude.



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