IPC TM-650 2.4.34-1995
Solder Paste Viscosity - T-Bar Spin Spindle Method (Applicable for 300,000 to 1,600,000 Centipoise)

Standard No.
IPC TM-650 2.4.34-1995
Release Date
1995
Published By
Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Scope
The data reproduced in this report is published for informational purposes only. It is based on data voluntarily contributed by members of the IPC. The IPC disclaims all liability of any kind for the use, application or adaptation of the material published in this document.



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