IPC TM-650 2.4.24.4-1998
Glass Transition and Modulus of Materials Used in High Density Interconnection (HDI) and Microvias - DMA Method

Standard No.

IPC TM-650 2.4.24.4-1998

Release Date

1998

Published By

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

Scope

The ad hoc team choose to use the round robin approach to quantitatively measure the . effects of each variable at several levels. The round robin was developed and executed as a joint effort to minimize disagreements and maximize accuracy. The Steam Aging Round Robin was developed and approved by June 1989 (see Appendix A).