Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Status
Scope
This document provides information for preparation of
components for assembly to printed boards, contains a
review of some pertinent design criteria, impacts and
issues, techniques of general interest for assembly (both
manual and machines) and discusses considerations of, and
impacts upon, subsequent soldering, cleaning, and coating
processes. The information herein consists of compiled
data representing commercial and industrial applications.