Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Status
Scope
This specification covers the requirements for copper/invar/
copper (CIC), copper/molybdenum/copper (CMC), threelayer
composite. The CIC material consists of copper
bonded to each side of a layer of invar (nominal 36%
nickel and 64% iron alloy). The copper clad molybdenum
consists of copper bonded to each side of molybdenum.