IPC TM-650 2.3.1-1973
Chemical Processing, Suitable Processing Material
- Standard No.
- IPC TM-650 2.3.1-1973
- Release Date
- 1973
- Published By
- Institute of Interconnecting and Packaging Electronic Circuits (IPC)
- Scope
- The reported results are based on the work done by the Copper Foil Rupture Round Robin Task Group, chaired by Louis Zakraysek, EMK Testing Company Inc., under the auspices of the Metallic Foil Subcommittee of the Base Materials Corrimittee of the Institute for Interconnecting and Packaging Electronic Circuits (IPC).
