IPC TM-650 2.2.12.2-1989
Weight and Thickness of Copper Foils with Releasable Carriers

Standard No.
IPC TM-650 2.2.12.2-1989
Release Date
1989
Published By
Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Scope
Electronics manufacturers are faced with the difficult task of proving that a candidate manufacturing process can produce acceptable hardware, either to the customer of the product, or for internal quality control. In the past, assembly level specifications (e.g. MIL-STD-2000A) told you exactly how to go about this demonstration. It wasn’t always precisely correct, but you didn’t have to figure our all of the fine points of the qualification on your own. In our modem era, “how-to” specifications are now evil things and taboo to all involved with them. The users now have to determine many of the process qualification-steps on their own, and sadly, many don’t have the faintest idea where to start. That is the purpose of this document. It makes no assumptions about what you know and leads you through the somewhat complex task of qualifying a candidate process to the B revision of J-STD-001.



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