Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Status
Scope
This Standard covers dimensioning and tolerancing
of electronic packaging as it relates to printed
boards and the assembly of printed boards. The concepts
defined in this Standard are derived from ASME Y14.5”
1994. Printed boards have such wide applications that there
may be times where this standard does not address a specific
case. In those cases, the user is referred to ASME
Y14.5M 1994 for use of additional dimensioning and tolerancing
concepts.