Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Status
Scope
This document covers requirements and test methods for
anisotropically conductive adhesive films used to bond and
electrically connect components and for their long-term
properties as a part of the printed wiring board assembly.
Applications include the foliowing: flexible PWB-to-glass,
flexible PWB-to-rigid PW, flip chip-to-glass, flip chip-toflexible
PWB, flip chip-to-rigid PWB, and fine pitch SMD.
The adhesive film may be supplied pre-attached to a flexible
circuit or other product.