Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Status
Scope
This document covers guidelines for selecting electrically
conductive adhesives for use in assembly of components to
printed circuit boards (PCB) or similar wiring interconnect
systems. The focus is on the use of adhesives as solder
alternatives. The process discussion attempts to stay within
the bounds of the existing solder assembly infrastructure as
much as possible. Both major types of adhesives, isotropic
(conducting equally in all directions) and anisotropic (unidirectional
conductivity), are covered. The two major divisions
of polymer adhesives, thermosets and thermoplastics,
are described.