Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Status
Scope
This standard establishes the construction detail requirements for bumps and other terminal structures on flip chips and chip
scale carriers. All flip chip and chip scale device terminals shall meet the designated standards detailed in this document
which includes such diverse terminations as solder bumps, columns, non-melting stand-Offs and conductive polymer deposits.
The specific standards for different terminations will therefore be appropriately matched to the particular interconnection.