Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Status
Scope
This specification sets the requirements for
the use of Electroless Nickel/Immersion Gold (ENIG) as a
surface finish for printed circuit boards. This specification
is intended to set requirements for ENIG deposit thicknesses
based on performance criteria. It is intended for use
by supplier, printed circuit manufacturer, electronics manufacturing
services (EMS) and original equipment manufacturer
(OEM).