IPC TM-650 2.5.3-1997
Current Breakdown, Plated Through-Holes Revision B

Standard No.
IPC TM-650 2.5.3-1997
Release Date
1997
Published By
Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Status
Scope
The intent of this specification is to provide a standard method for developing process control files used by electronics manufacturing equipment. Process control files (often referred to as recipes) provide the instruction sets used by assembly equipment to accomplish specified tasks.



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