IPC TM-650 2.4.48-1995
Spitting of Flux-Cored Wire Solder

Standard No.

IPC TM-650 2.4.48-1995

Release Date

1995

Published By

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

Scope

This standard specifies data formats used to describe drawing methodologies for printed boards and printed board assemblies. These formats may be used for transmitting information between a printed board designer and a printed board manufacturer.