IPC TM-650 2.4.47-1995
Flux Residue Dryness

Standard No.
IPC TM-650 2.4.47-1995
Release Date
1995
Published By
Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Scope
This standard specifies the XML schema that represents the data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, inspection and testing requirements. This format may be used for transmitting information between a printed board designer and a manufacturing or assembly facility. The data is most useful when the manufacturing cycle includes computer-aided processes and numerical control machines.



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