IPC TM-650 2.4.46-2004
Spread Test, Liquid, Paste or Solid Flux, or Flux Extracted from Solder Paste, Cored Wires or Preforms Revision A

Standard No.
IPC TM-650 2.4.46-2004
Release Date
2004
Published By
Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Status
Scope
Information flow is essential to efficient electronics manufacturing and standards are essential to information flow. One area of commerce that has lacked its own communication standards is the electronics manufacturing factory floor. Information exchange between a system of electronic assembly equipment and higher-level applications has, in the past, used proprietary or borrowed standards. The IPC-254X and IPC-255X series of standards address this issue by defining the messages needed for this information exchange.



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