IPC TM-650 2.4.40-1987
Inner Layer Bond Strength of Multilayer Printed Circuit Boards

Standard No.

IPC TM-650 2.4.40-1987

Release Date

1987

Published By

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

Scope

This International Standard relates to grid systems for printed circuits to ensure compatibility between the printed circuits and parts to be mounted on them at the intersections of the grid.