IPC TM-650 2.4.34.1-1995
Solder Paste Viscosity - T-Bar Spindle Method (Applicable at Less Than 300,000 Centerpoise)

Standard No.

IPC TM-650 2.4.34.1-1995

Release Date

1995

Published By

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

Scope

This document addresses the implementation of optical and optoelectronic packaging technologies.