IPC 9701A-2006
Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

Standard No.

IPC 9701A-2006

Release Date

2006

Published By

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

Scope

This specification establishes specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies. It further establishes different levels of performance and reliability of the solder attachments of surface mount devices to rigid, flexible and rigid-flex circuit structures. In addition, it provides an approximate means of relating the results from these performance tests to the reliability of solder attachments for the use environments and conditions of electronic assemblies.